Full swath analysis

ABSTRACT

An inspection system for detecting anomalies on a substrate. A first network is coupled to a sensor array and communicates image data. Process nodes are coupled to the first network, and processes the data to produce reports. Each process node has an interface card that formats the data for a high speed interface bus that is coupled to the interface card. A computer receives and processes the data to produce the anomaly report. A second network receives the anomaly reports from the process nodes. A job manager is coupled to the second network, and receives the anomaly reports from the process nodes and sends information to the process nodes to coordinate the processing of the data in the process nodes.

FIELD

This invention relates to the field of integrated circuit fabrication.More particularly, this invention relates to substrate inspectionsystems. This application relates to the copending applications listedbelow, all of which were filed on 2004 Oct. 18:

Attorney Docket Number Application Serial Number U.S. Pat. No. 59564.US10967388 59565.US 10967397 59566.US 10967419 59567.US 10967542 59568.US10967375 59570.US 10967500 59571.US 10967376 59572.US 10967832 59573.US10967420 59574.US 10967418

BACKGROUND

Integrated circuit manufacturers use inspection systems to detectanomalies, such as defects, in substrates. Generally, an inspectionsystem rasters the surface of the substrate with one or more opticalsensors, and generates image data based on the images detected by thesensors. This image data is analyzed according to one or more of avariety of different algorithms to determine where defects might existon the substrate. Integrated circuit manufacturers demand that suchinspection systems meet several criteria. Among these criteria is thatthe inspection system must be extremely accurate, fast, and reliable.Further, such inspection systems should preferably be reasonably pricedand relatively flexible.

Prior art inspection systems have implemented one or both of pipelinedsystems or computers that are networked in a switched fabric topology,which use highly customized hardware. Customized hardware has severaldisadvantages as compared to commercially available hardware, includinghigher nonrecurring engineering costs for the developer, lowerreliability, longer development times, and more inflexibility inchanging algorithms. Switched fabric systems have additionaldisadvantages, including high cost, lack of standards betweenmanufacturers, and development lag in the components, such as the levelof microprocessor that is built into such systems.

Commercial hardware, by contrast, tends to be more reliable, moreversatile, and less expensive. For example, large computer manufacturersdevote a tremendous amount of engineering effort to ensure that thelatest technologies are implemented in their products, and that thoseproducts are brought to market as soon as possible. This largeengineering effort is then factored into the price of the many, manyunits that they anticipate selling. Thus, the large development costsare spread quite thin as to each unit that is purchased. The developmentcosts for customized hardware, on the other hand, must be borne on arelatively very small number of units.

Further, once a commercial product is developed, the engineering supportteam continually updates, improves, and bug fixes that product. Again,these costs are distributed over all of the many units that are sold bya large manufacturer. Again, the expenses of such efforts for customizedhardware must be borne by a very few units. Often, the number of unitsmakes such levels of support for customized hardware financiallyunreasonable to offer or to buy. Thus, prior art inspection systems,while perhaps having acceptable speed and accuracy, have been woefullylacking in the categories of flexibility, reliability, and cost.

What is needed, therefore, is a system that overcomes problems such asthose described above, at least in part.

SUMMARY

The above and other needs are met by an inspection system for detectinganomalies on a substrate. The inspection system has a sensor array forgenerating image data. A first high speed network is coupled to thesensor array and receives and communicates the image data. An array ofprocess nodes is coupled to the first high speed network, and receivesand processes the image data to produce anomaly reports. Each of theprocess nodes has an amount of memory that is sufficient to receiveimage data representing a plurality of dice on an integrated circuitwafer, and each of the process nodes performs analysis on the pluralityof dice.

Each process node has an interface card coupled to the first high speednetwork, that receives the image data from the first high speed networkand formats the image data according to a high speed interface busprotocol. A high speed interface bus is coupled to the interface card,receives the image data from the interface card. A computer is coupledto the high speed interface bus, and receives the image data from thehigh speed interface bus and processes the image data according to analgorithm, to produce the anomaly report. A second high speed network iscoupled to the process nodes, and receives the anomaly reports from theprocess nodes. A job manager is coupled to the second high speednetwork, and receives the anomaly reports from the process nodes andsends information to the process nodes to coordinate the processing ofthe image data in the array of process nodes.

In this manner, data marshalling can be done ahead of time on a separatemachine. Image data processing can be scaled up without a switchedfabric. There is no dependence upon any particular type of centralprocessing unit or operating system. Image processing may beaccomplished using a graphics processing unit or a field programmablegate array instead of or in combination with a general purpose centralprocessing unit.

In various embodiments, the first high speed network is a fiber opticnetwork, and preferably implements a serial, full duplex data transferarchitecture. Preferably, the sensor array includes a time delay andintegration sensor. Each process node is preferably a commerciallyavailable computer, such as a dual two gigahertz G5 PowerMac computer.Preferably, the high speed interface bus protocol is PCI-X. The secondhigh speed network is preferably a gigabit Ethernet network. Eachinterface card preferably includes a field programmable gate array thatformats the image data for transfer according to the high speedinterface bus protocol, a memory that receives and buffers the imagedata between the interface card and the computer, and four fiber inputsthat receive the image data from the first high speed network.

The sensor array preferably provides the image data in four sections,and the first high speed network includes four independent lines, whereeach of the four independent lines is coupled to a corresponding one ofthe four sections of the sensor array. The array of process nodespreferably has four columns of process nodes, where each of the fourcolumns of process nodes is coupled to a corresponding one of the fourindependent lines.

BRIEF DESCRIPTION OF THE DRAWINGS

Further advantages of the invention are apparent by reference to thedetailed description when considered in conjunction with the figures,which are not to scale so as to more clearly show the details, whereinlike reference numbers indicate like elements throughout the severalviews, and wherein:

FIG. 1 is a functional block diagram of an inspection system accordingto a preferred embodiment of the invention.

FIG. 2 is a functional block diagram of an interface of a process nodeof the inspection system of FIG. 1, according to a preferred embodimentof the invention.

DETAILED DESCRIPTION

One advantage of the inspection system 10 described herein is that thecomponents are readily commercially available and do not requirecustomized design and manufacture, except perhaps an interface 22, whichis relatively easily produced. This has a number of advantages. First,the reliability of the inspection system 10 is generally increased byusing components for which a large engineering effort has been invested,for which upgrades and fixes are continually produced, and which have agood track record in the marketplace. In addition, with large numbers ofa single component being produced by the original manufacturer, problemsare generally discovered faster and fixed sooner.

Further, commercially available computers, such as the process nodes 20and other components as described below, can run many different kinds ofalgorithms, whereas customized hardware, and more especially thecustomized and optimized hardware that is so prevalent in prior artinspection systems, tends to be extremely limited in what it can do,because the cost of adding additional functionality to such customizedhardware is extremely high.

With reference now to FIG. 1, there is depicted a functional blockdiagram of an inspection system 10 according to a preferred embodimentof the present invention. A general description of the inspection system10 is first presented. Following the general description, more detaileddescriptions of various aspects of the inspection system 10 arepresented.

General Description

The inspection system 10 is preferably used for analyzing image data,such as that gathered from optical sensors. For example, both brightfield inspection systems and dark field inspection systems use opticalsensors. In various embodiments, the inspection system 10 includes asensor array 26, which is operable for optically gathering the imagedata. The sensor array 26 as depicted in simplified form in FIG. 1preferably includes functions such as those provided by a common runtime alignment processor, which sends the image data out on differentoutput streams 58.

The sensor array 26 preferably includes sensors and handling systems foroptically inspecting substrates, such as the substrates that are used inintegrated circuit fabrication processes, such as semiconductor wafers,masks, reticles, and other such substrates. Thus, the inspection system10 is particularly well adapted to the integrated circuit fabricationindustry, which relies greatly upon the optical inspection of suchsubstrates.

As the term is used herein, “integrated circuit” includes devices suchas those formed on monolithic semiconducting substrates, such as thoseformed of group IV materials like silicon or germanium, or group III–Vcompounds like gallium arsenide, or mixtures of such materials. The termincludes all types of devices formed, such as memory and logic, and alldesigns of such devices, such as MOS and bipolar. The term alsocomprehends applications such as flat panel displays, solar cells, andcharge coupled devices.

In a most preferred embodiment, the sensors in the sensor array 26 aretime domain and integration sensors. However, in other embodiments,other sensor types may also be used. The substrate handling systems inthe sensor array 26 are preferably adapted to automatically unload thesubstrate from an input staging system, such as from a cassette, movethe substrate under the sensors, such as by moving one or both of thesensors and the substrate relative to one another, and then load thesubstrate back into an output staging system, such as a cassette.

Thus, in its most preferred embodiments, the inspection system 10 isadapted to automatically inspect the substrate and produce image data.However, in alternate embodiments the inspection system 10 can acceptimage data that has been stored for later analysis, either in additionto or in place of image data that is being generated in real time.

Many different factors of the inspection 10 combine to produce a verylarge quantity of image data at a very fast rate. Because of the verysmall size of modern integrated circuits, the imaging of the substratesby the inspection system 10 is preferably performed at a very highmagnification. The inspection system 10 is preferably adapted to detectanomalies on the substrate, which may be defects such as scratches,extraneous particles, voids, short circuits, open circuits, and soforth. To support the optical inspection of such very small features,the pixel size for the sensors is preferably about one tenth of amicron. This small pixel size is one of the factors in the large amountof image data that is produced, and the high rate at which it isproduced.

In addition, the inspection system 10 is preferably adapted to handlerelatively large substrates having a diameter of about a foot or more.Further, the substrate handling system of the sensor array 26 preferablymoves the substrate as rapidly as can be supported by the rest of theinspection system 10, so that the inspection system 10 can process asmany substrates within a given length of time as possible. As introducedabove, all of this combines to create a very large amount of image datathat is delivered at a very fast rate.

For example, the inspection system 10 preferably generates more thanthree billion pixels per second, with each pixel having eight grayscalebits. This produces an image data stream of over three gigabytes persecond. Thus, the preferred embodiments of the present invention asdescribed in greater detail below are adapted to process large amountsof data through a variety of different means.

The inspection system 10 is preferably under the control of a controlcomputer 12, which provides top level control for the inspection system10, including the storage, selection, and delivery of the recipes bywhich the inspection system 10 is controlled, interfacing with systemoperators, and receipt, storage, and delivery of information from and toother computer systems on a network.

However, because the inspection system 10 preferably handles largeamounts of data at high rates as described above, there is preferably atleast one job manager 14 that performs most if not all of the detailedcontrol aspects for the various components of the inspection system 10.The number of job managers 14 that are implemented preferably variesaccording to various criteria, such as the type of inspection that isperformed by the inspection system 10—be it bright field or dark field,for example.

The job manager 14 is most preferably a logical structure, such as a setof Java routines that run on a host computer. In a preferred embodiment,the job manager 14 is hosted on a separate computer that is usedsubstantially only for that function. Such a configuration tends toisolate the job managers 14 from other computational demands that may behosted by a commonly used computer. However, in alternate embodimentsthe job manager 14 is hosted on a common computing platform, such as onthe control computer 12.

The job manager 14 preferably, among other things, directs thetransmission of image data to the process nodes 20 for processing.Stated in other words, the job manager 14 does not actually transfer theimage data to the process nodes 20, but directs other components of theinspection system 10 to do, as described in more detail below. The jobmanager 14 preferably also provides instructions for the inspection ofthe image data to the process nodes 20. The instructions preferablydefine inspection parameters such as pixel size, optics mode, number ofgray scales, inspection swath length, and so forth.

The control computer 12, job manager 14, and sensor array 26 are allpreferably in communication with one another through a network, which ismost preferably a relatively high speed network such as gigabitEthernet. It is appreciated that other protocols besides Ethernet couldalso be used, and speeds other than gigabit could also be used. However,gigabit Ethernet is preferred for this portion of the communicationbetween the components, because it has a relatively high bandwidth thatgenerally supports the design goals of high data throughput in theinspection system 10.

In various embodiments, the network connections 44, 46, and 48 are madethrough one or more network switches. Alternately, other devices such asrouters or hubs could be used for this purpose. In one embodiment, allof these network connections are made through the same switch, such asswitch 16 or switch 18. However, in a most preferred embodiment, thesenetwork connections are locally made through a first switch 16, so thatcontrol information that is delivered between the job manager 14,control computer 12, and sensor array 26 does not steal bandwidth fromother network connections, which are described in more detail below.

In such a configuration, the first switch 16 is preferably connected toa second switch 18, such as via a network connection 54. Other networkconnections are preferably also made to the second switch 18, asdescribed in more detail below. Most preferably, the job manager 14 isconnected to both the first switch 16, so as to communicate lowerpriority instructions to the elements of the inspection system 10 asdescribed above, and also to the second switch 18, so as to communicatehigher priority instructions to other elements of the inspection system10, as describe in more detail below.

The analysis of the image data is preferably accomplished by a nodearray 60 of the inspection system 10. The node array 60 is preferably anarray of process nodes 20, which can be thought of as being disposed inrows 28, 30, 32, and 34 and columns 36, 38, 40, and 42. The number ofrows and column as depicted in the node array 60 of FIG. 1 is by way ofexample only, and is preferably determined by factors that are describedin more detail below. The process nodes 20 preferably receive image dataon lines 58 of a high speed network, such as a fiber optic network.Although a different protocol may be used for the high speed network 58,such as gigabit Ethernet, Firewire, high speed USB, or fast wide ultraSCSI, fiber optic tends to have greater bandwidth when used incombination with the other components of the inspection system 10 thanthese other options, and so tends to be more preferred.

The portion of the image data that is delivered on the network 58 to asingle column of process nodes 36, 38, 40, or 42 preferably comes from agiven portion of the sensors in the sensor array 26. For example, thefirst column 36 may receive image data from a first quarter portion of atime delay and integration sensor, the second column 38 may receiveimage data from a second quarter portion of the sensor, the third column40 from a third quarter portion, and the fourth column 42 from a fourthquarter portion. The process nodes 20 in a given column are preferableconnected to the network 58 in a daisy chain topology, as described inmore detail hereafter.

In one embodiment, each of the process nodes 20 is a dual processor G5PowerMac computer running OS X, as manufactured by Apple Computer, Inc.of Cupertino Calif., preferably operating at a clock speed of at leastabout two gigahertz. The inspection system 10 preferably includes atleast twelve of the process nodes 20, which are most preferably disposedin four logical columns of three rows each. However, the samecomputational capacity might also be provided in other embodiments witha total of eight different three gigahertz, dual processor computers,which are preferably disposed in four columns of two rows each. It isappreciated that the selection, number, and arrangement of the processnodes 20 in the inspection system 10 is adjustable as necessary tohandle the desired throughput of image data.

It is appreciated that other computers besides PowerMac computers may beused in the inspection system 10. For example, Opteron based computers,as manufactured by Advanced Micro Devices, Inc. of Sunnyvale Calif.,having similar speeds and memory capacity could also be used with theLinux operating system. However, because of the interdependencies of thecomputations being performed by each of the process nodes 20, mostpreferably all of the process nodes 20 in a given inspection system 10are of the same type and configuration. Each of the process nodes 20preferably includes at least about three gigabytes of memory. Thecomputer hosting the job managers 14 is preferably of a similar class,with some differences. Speed is also important for the job manager 14,but data buffering is less so and storage space is more so than for theprocess nodes 20. Thus, while the process nodes 20 preferably have lotsof memory and no hard drive, the job manager 14 preferably has lessmemory and at least one hard drive.

The process nodes 20 most preferably receive the image data through aninterface 22 that is preferably installed in each process node 20, whichinterface 22 is adapted to receive the image data on the high speednetwork 58, and provide it to the process node 20 at a speed that ispreferably at least as fast as the speed at which a given process node20 can process the image data. This speed is most preferably no lessthan about eight hundred megabits per second. However, in embodimentswhere a greater number of process nodes 20 can be used, each processnode 20 does not need to accept the image data at such a high rate ofspeed. However, by preferably maximizing the image data delivery rate tothe process nodes 20, fewer process nodes 20 are required, and theoverall cost of the inspection system 10 is generally reduced. Theinterface 22 most preferably performs some amount of processing on theimage data that it receives, such as verifying checksums, stripping offpacket headers, and re-ordering the bits to more fully optimize theimage data stream for processing by the process node 20.

The process nodes 20 preferably analyze the image data that is sent tothem, and generate reports on the image data that they have analyzed.The reports from the process nodes 20 are preferably delivered to thejob manager 14. Most preferably, the process nodes 20 communicate withthe job manager, and other elements of the inspection system 10 as maybe desired, through the network connections 56. In the preferredembodiment, the network 56 is again a gigabit Ethernet network, and theconnections 56 are most preferably made to the second switch 18.However, in other embodiments, other protocols and topologies can alsobe used, as described above.

The processing of the image data by the process nodes 20 is mostpreferably accomplished with relatively high speed routines, such asthose written in a programming language such as C. Communication betweenthe process nodes 20 and other components, such as the job manager 14,is preferably accomplished with a low overhead routine, such as thosewritten in a programming language such as Java, and most preferablyusing the remote method invocation protocol.

Because the process nodes 20 receive image data at an extremely highrate, they tend to generate the reports at a high rate. However, becausethe reports preferably do not contain as much data as the image data, arelatively slower network can be used to communicate the reports to thejob manager 14 than is used to communicate the image data to the processnodes 20. Therefore, high speed fiber 58 is preferably used for theimage data, and relatively slower gigabit Ethernet 56 is preferably usedfor reporting. It is appreciated that the network 56 may run at a slowerspeed than gigabit, such as one or more of the automatic fallback ratesof one hundred megabits per second and ten megabits per second, assupported by the gigabit Ethernet protocol.

Preferably, the network 56 also carries instructions from the jobmanager 14 to the process nodes 20. These instructions includeinformation such as set up data and processing instructions that are tobe performed on the image data. Because the process nodes 20 areoperating under a relatively heavy computational load, and thus mayrequire such instructions at a fairly rapid rate, and also because thereports delivered by the process nodes 20 are sent at a relatively highrate, the job manager 14 preferably has a second network connection 52to the second switch 18, through which such higher prioritycommunication is preferably accomplished.

Various aspects of the inspection system 10 are now presented in greaterdetail in the following sections.

Image Data Interface

As introduced above, the image data delivered to the process nodes 20 ismost preferably divided into four streams, with each stream preferablyrepresenting a one-quarter portion of an inspection swath on thesubstrate that is about five hundred and twelve pixels wide. One of eachof these four image data streams is preferably delivered to one of eachof the four columns 36, 38, 40, and 42 of the process nodes 20. Asmentioned above, the number of columns and the segmentation of the imagedata stream can be set at other values besides four. The fiber opticnetwork 58 preferably delivers the image data at a rate of about eighthundred megabytes per second. In a preferred embodiment, the fibernetwork 58 implements a serial, full duplex data transfer architecture.

In the embodiment of FIG. 1, the image data is received by the interface22, which is preferably installed in each process node 20. In onepreferred embodiment, the interfaces 22 are input data adapter cardshaving serial fiber optic inputs, such as transceivers 100, whichconvert the fiber optic image data received on the fiber network 58 intoelectrical image data, and deliver the image data to a pre processor,such as a field programmable gate array 102, all as depicted in FIG. 2.The transceivers 100 preferably support a bandwidth of about two and ahalf gigabits per second. Most preferably, each of the interfaces 22 hasfour such transceivers 100, with each of the transceivers 100 in eachprocess node 20 of a given column 36, 38, 40, and 42 independently daisychained to the corresponding transceivers 100 in each of the otherprocess nodes 20 within the column 36, 38, 40, or 42 of the node array60. Thus, the network 58 preferably provide four connections to eachcolumn of process nodes 20 in the node array 60. Three of these fourconnections are depicted as stubs in FIG. 1, so as to not unduly burdenthe figure with detail.

In some embodiments, the gate array 102 provides some image dataprocessing functions, such as segmented auto thresholding histogramming.The gate array 102 is preferably additionally adapted to handle inputtracking, input processing, PCI-X interface, and memory interfaceprocesses. The interface 22 preferably includes at least about one totwo gigabytes of buffer memory 104, which is used to buffer the imagedata as necessary prior to transferring it to the memory in the processnode 22. If the process node 20 can keep up with the flow of image datareceived on the network 58, then no buffering is needed. However, if theprocess node 20 cannot sustain that rate of data flow, such as forintermittent periods of time, then the backlog of image data ispreferably buffered in the memory 104. The interface 22 preferablycommunicates with the process node 20 through a PCI-X slot 106, althoughinterface protocols with similar bandwidth capabilities of at leastabout eight hundred megabits per second could also be used.

Memory Load Balancing

As described above, the process nodes 20 are preferably adapted to storea portion of the image data that they receive, such as within the buffer104 of the interface 22. Thus, the process nodes 20 preferably have asufficient amount of memory to continue receiving image data even if therate of analysis of the image data within the process node 20 fallsbelow the rate of data acquisition by the process node 20. In thismanner, the inspection system 10 can readily handle a peak load of imagedata without slowing down image data acquisition and analysis.

For example, at a standard load of delivery of the image data, a givenprocess node 20 may be able to process the image data at a faster raterthan it is delivered. In such a situation, the buffer memory 104 isgenerally not used to buffer any significant amount of the image data,because there is no need to relieve the computational load on theprocess node 20. However, for various reasons, such as the scanning ofparticularly complex portion of the substrate that is being inspected, arelatively large amount of image data may be delivered within a briefperiod of time, or the process node 20 may take a longer period of timeto process the image data that it has already received.

If the additional image data load extends beyond that which the processnode 20 is capable of processing on the fly, the additional image dataload is preferably buffered, such as in the memory 104 in a first in,first out process. Then, when the image data load ebbs again, theprocess node 20 receives the buffered image data, and starts receivingthe image data without it building up a load within the buffer 104. Suchcontrol of the delivery of the image data is most preferably under thecontrol of the gate array 102, as explained in more detail elsewhereherein.

With the buffer 104 configuration as described above, the softwarerequirement for the inspection system 10 is significantly less than thatfor prior art inspection systems. For example, the job manager 14preferably does not provide dynamic load balancing between the processnodes 20, because the process nodes 20 are preferably assigned to asegmented stream of the image data from the sensor array 26, and havesufficient memory and speed for handling the peak loads of the imagedata stream. Thus, no complex and expensive switched fabric topology isneeded, as is commonly employed in prior art systems. Further, thenumber of process nodes 20 used in the node array 60 can be kept at anumber that is less than that which would otherwise be required tohandle a peak load of image data, resulting in a lower overall cost forthe inspection system 10, without compromising the throughput of theinspection system 10.

Status Polling

As introduced above, the image data is preferably moved from theinterface 22 to the process node 20 via direct memory access. As theprocess node 20 is able to accommodate more image data, the interface 22delivers the image data through the PCI-X interface 106, and when theprocess node 20 cannot handle more image data, the interface 22 buffersthe image data in the buffer memory 104.

In prior art designs, an interrupt is used as a signal when more datacan be delivered via a direct memory access process. However, interruptsare typically handled by the central processing unit of the host, whichin this case is the process node 20. As described at length above, theprocess node 20 is under a severe computational load, and variousaspects of the inspection system 10 are designed to preferably keep theprocess node 20 processing image data as fast as it can. Thus, anyadditional computation load on the process node 20 is unwelcome.

Therefore, the inspection system 10 according to the preferredembodiments of the invention does not use interrupts to signal whenadditional image data can be delivered via direct memory access to theprocess node 20. Rather, a polling method is used. In one embodiment,the gate array 102 polls a register or some other memory location todetermine the status of the register. When the register is in a firststatus, then the process node 20 will accept more image data via directmemory access, and when the register is in a second status, then theprocess node 20 will not accept more image data via direct memoryaccess. In this manner, the image data is delivered in a smooth mannervia direct memory access, without losing the processing cycles on theprocess node 20 that would otherwise be required to handle an interrupt.

Daisy Chain Topology

The benefits of disposing the process nodes 20 into columns 36, 38, 40,and 42 have been generally described above. Some of the benefits ofdisposing the process nodes 20 into different rows 34, 32, 30, and 28are now described. In addition to load leveling the computationaldemands of the inspection system 10 by increasing the memory capacity ofthe process nodes 20 and providing buffer memory 104 in the interface22, the architecture of the node array 60 also both increases thecapacity and levels the computational load of the inspection system 10.

For example, with reference to FIG. 1, first swaths or portions of theimage data stream are sent out on the network 58. Because the fourprocess nodes 20 in row 34 of the node array 60 are not working onanything else at the time that the first portion of the image data isdelivered, they accept the first portion of the image data, and theprocess 5 nodes 20 in row 34 begin processing the first portions of theimage data. While the process nodes 20 in row 34 are still processingthe first portions of the image data, second portions of the image datastream are sent out on the network 58. However, this time the fourprocess nodes 20 in row 34 of the node array 60 are busy processing thefirst portion of the image data stream, and thus they preferably do notaccept the second portion of the data stream.

Instead, the transceivers 100 of the interfaces 22 reflect the secondportions of the image data stream back out onto the network 58, to bereceived by the four process nodes 20 in row 32 of the node array 60.Because the four process nodes 20 in row 32 of the node array 60 are notdoing anything else at the time, they accept the second portions of theimage data, and the process nodes 20 in row 32 begin processing thesecond portions of the image data. By the time third portions of theimage data stream are provided by the sensor array 26 on the network 58,and one or more of various different options can be implemented.

In a first example, the process nodes 20 in row 34 of the node array 60have completed processing the first portions of the image data stream,and thus they can receive and process the third portions of the imagedata stream. If the process nodes 20 in row 34 of the node array 60 havenot as yet completed processing the first portions of the image datastream, then the third portions of the image data stream can optionallystill be sent to the process nodes 20 in row 34, to be buffered inmemory, such as the memory 104, before being processed by the processnodes 20, because each of the process nodes 20 preferably has enoughmemory to hold at least two such portions of image data. In this manner,as long as no one of the process nodes 20 within a row of the node array60 does not get too far behind in computation, the inspection system 10will not stall.

Alternately, additional rows 30 and 28 of process nodes 20 may beimplemented in the node array 60. In this manner, either the memoryrequirements for each of the process nodes 20 may be reduced, or thespeed at which image data is delivered to the inspection system 10 maybe increased, or additional processing of each portion of the image datamay be accomplished by each process node 20. In one embodiment, thecontrol of such decisions is preferably specified at the job manager 14,and implemented within the gate array 102, which determines whether itwill or will not accept the image data.

This bumping of the successive portions of the image data is enabled, atleast in part, by the daisy chain topology of the network 58. Preferablyunder the control of the gate array 102, portions of the image data arebumped to rows of process nodes 20 that are deeper within the node 60,when the shallower process nodes 20 are busy. In a most preferredembodiment, if one of the process nodes 20 within a row of the nodearray 60 is not able to accept an image data portion, then none of theprocess nodes 20 within the row of the node array 60 accepts the imagedata portion, and the image data portion is bumped via the network 58 tothe next deeper row of process nodes 20 within the node array 60. Inalternate embodiments, the different columns of process nodes 20 withina given row are more independent, and bumping occurs within a givencolumn from one row to another based only upon the load of the shallowerprocess nodes 20 within that column.

In alternate embodiments, this daisy chain topology as preferablyimplemented in the fiber network 58 can be implemented in other networkprotocols, such as gigabit Ethernet. However, fiber network 58 ispreferred because of the generally greater bandwidth which it affords.

The number of rows and columns in the node array 60 and the processingcapabilities of the process nodes 20 are all preferably interrelated. Itis preferred to send image data to the node array 60 on the network 58as fast as it can be generated by the sensor array 26. Thus, it is alsopreferred to process the image data with the node array 60 as fast as itcan be sent by the network 58. By increasing the number of column withinthe node array 60 and dividing the swath of image data into a number ofdifferent segments that preferably corresponds to that number ofcolumns, the computational requirements of each process node 20 in thenode array 60 generally decreases for a given level of image datadelivery. By increasing the number of rows within the node array 60, thecomputational requirements of each process node 20 in the node array 60further generally decreases for a given level of image data delivery.

By selecting process nodes 20 with as high a computational capacity asis practical, the number of rows and columns in the node array 60 cangenerally be reduced for a given level of image data delivery. Thus,process nodes 60 with relatively high computational capacities arepreferably selected. The number of rows and columns in the node array 60is then preferably set so that the node array 60 can process an amountof image data that represents the faster average amount that can bedelivered by the sensor array 26 on the network 58. Memory is added toeither the process node 20 or the interface 22 as described above tohandle any additional, intermittent computational load that might berequired, as described above. In this manner, the inspection system 10does not specify either too few or too many process nodes 20.

Full Swath Analysis

In the embodiments described above, the image data for a single swathhas preferably been segmented as delivered from the sensor array 26,such as into four quarter portions. It is appreciated that othersegmentations could also be used. However, in some embodiments, nosegmentation of the image data is desirable. Such an embodiment would,for example, allow for a greater portion of the imaged substrate to beused for detection of anomalies, such as defects. Such segmentation canbe specified, for example, by the job manager 14, and implemented in oneor more of the various components that are generally referred to as thesensor array 26 herein.

As described elsewhere above, the process nodes 20 preferably containsufficient memory, either within themselves or within the buffer memory104, to enable continued acquisition of image data even if the rate ofanalysis of the image data in the process node 20 falls behind the rateof image data acquisition. The process nodes 20 may also containsufficient memory so that an entire swath width of the image data may besent to a single column 36, 38, 40, or 42 of process nodes 20, withoutsegmenting the image data.

The architecture of the inspection system 10 would not need to changefrom that as depicted in FIG. 1. Rather, the job manager 14 couldinstruct the appropriate elements of the sensor array 26 to provide theentire swath of the image data along a single output of network 58 to asingle column of the node array 60. Alternately, the architecture of thenode array 60 could be changed to a single column. However,accomplishing the image data delivery as described in this section byusing instructions to the sensor array 26 rather than altering thearchitecture of the node array 60 provides for a much more adaptableinspection system 10.

To implement such an embodiment, each process node 20 would preferablyhave about six gigabytes of memory, which could either be resident inthe process node 20 itself, or within the buffer memory 104.

Mirror Node Verification

One goal of inspection system 10 is to maintain consistent and uniformprocessing by each of the process nodes 20. Each process node 20 in thenode array 60 preferably produces a report that is substantially similarto the report that would be generated by any other process node 20 inthe node array 60. Ensuring that this condition is met is of particularconcern when new hardware or software is introduced into the inspectionsystem 10.

In the preferred embodiment, a new process node 20 is configured tomirror one of the existing process nodes 20 within the node array 60.The job manager 14 is preferably configured to send instructions to boththe existing process node 20 and the mirror node. Most preferably, theinstructions are redundant in the case of the mirror node, so that theresults from the mirror node can be compared to the results from theexisting process node 20. The mirror node is preferably programmed bythe job manager 14 to produce the output that the process node 20produces, including information such as defect results, images,histograms, and projections.

The mirror node can exist in various logical positions within theinspection system 10 for example, the mirror node may be disposed withinthe node array 60, such as on one of the deeper rows 28 or 30, so thatit resides within a row that can be turned off in regard to normal imagedata processing, without substantially effecting the throughput of theinspection system 10. Alternately, the mirror node can be on the network56, such as through the switch 18, but be logically outside of the nodearray 60, in that it does not reduce the computational ability of thenode array 60 in any manner.

In yet another embodiment, the mirror node can be placed anywhere withinthe node array 60, but the job manager 14 instructs the inspectionsystem 10 to always have the process node 20 that is one row deeperwithin the same column of the node array 60 to also process the imagedata that is received by the mirror node. This is accomplished such asby the interface 22 reflecting all of the image data that is received bythe mirror node back out along the network 58 to be received by the nextdeeper process node 20, which is connected to the network 58 in thedaisy chain topology, as described in more detail elsewhere herein.

The job manager 14 preferably verifies whether the mirror node and theprocess node 20 produce results that are in agreement within anallowable tolerance. If they are not, then there is a problem with oneor more of the mirror node and the process node 20, and the job manager14 reports this condition. The job manager 14 is preferably programmedto not reject an inspected substrate based upon either a bad report fromthe mirror node or a discrepancy between the mirror node and the processnode 20.

If a discrepancy of too great a size exists between the mirror node andthe process node 20, it may be an indication that the mirror node isunacceptable, or alternately, it may be an indication that the processnode 20 is faltering. In this manner, the mirror node can be used as acheck of the various process nodes 20 within the node array 60. Furtheryet, a discrepancy may be an indication that both the mirror node andthe process node 20 are faulty.

In some embodiments, the mirror node is a candidate computer that is ofunknown performance, and the purpose of connecting the mirror node tothe inspection system 10 is to determine whether the mirror node isacceptable. In alternate embodiments the mirror node is known to beacceptable, and the purpose of connecting the mirror node to theinspection system 10 is to verify that the process node 20, which may beof unknown performance, is equivalent to the mirror node. In theseembodiments the mirror node is a known good computer.

If the mirror node is a candidate computer and the report from themirror node is unacceptably different from the report provided by theprocess node 20, then the mirror node is judged to not be acceptable. Ifthe mirror node is a known good computer and the report from the mirrornode is unacceptably different from the report provided by the processnode 20, then that process node is judged to not be acceptable, and thejob manager 14 preferably identifies it as a failed process node 20.Under such circumstances, the reports from the mirror node may besubstituted for the reports from the failed process node 20, until thefailed process node 20 can be replaced.

In some embodiments, the job manager 14 cyclically transmits the commonportion of the image data to the mirror node and the process node 20 forwhich the reports are being compared. In some embodiments involvingcyclical transmission, a regression analysis is performed on the testresults to determine differences among some or all of the process nodes20, and between the process node 20 and the mirror node.

The foregoing description of preferred embodiments for this inventionhas been presented for purposes of illustration and description. It isnot intended to be exhaustive or to limit the invention to the preciseform disclosed. Obvious modifications or variations are possible inlight of the above teachings. The embodiments are chosen and describedin an effort to provide the best illustrations of the principles of theinvention and its practical application, and to thereby enable one ofordinary skill in the art to utilize the invention in variousembodiments and with various modifications as are suited to theparticular use contemplated. All such modifications and variations arewithin the scope of the invention as determined by the appended claimswhen interpreted in accordance with the breadth to which they arefairly, legally, and equitably entitled.

1. An inspection system for detecting anomalies on a substrate, theinspection system comprising: a sensor array for generating image data,a first high speed network coupled to the sensor array and adapted toreceive and communicate the image data, an array of process nodescoupled to the first high speed network and adapted to receive andprocess the image data to produce anomaly reports, each process nodehaving, an interface card coupled to the first high speed network andadapted to receive the image data from the first high speed network andformat the image data according to a high speed interface bus protocol,a high speed interface bus coupled to the interface card and adapted toreceive the image data from the interface card, and a computer coupledto the high speed interface bus and adapted to receive the image datafrom the high speed interface bus and process the image data accordingto an algorithm to produce the anomaly report, wherein each of theprocess nodes has an amount of memory that is sufficient to receiveimage data representing a plurality of dice on an integrated circuitwafer, and each of the process nodes performs analysis on the pluralityof dice, a second high speed network coupled to the process nodes andadapted to receive the anomaly reports from the process nodes, and a jobmanager coupled to the second high speed network and adapted to receivethe anomaly reports from the process nodes and send information to theprocess nodes to coordinate the processing of the image data in thearray of process nodes.
 2. The inspection system of claim 1 wherein thefirst high speed network is a fiber optic network.
 3. The inspectionsystem of claim 1 wherein the first high speed network implements aserial, full duplex data transfer architecture.
 4. The inspection systemof claim 1 wherein the sensor array includes a time delay andintegration sensor.
 5. The inspection system of claim 1 wherein eachprocess node comprises a commercially available computer.
 6. Theinspection system of claim 1 wherein each process node comprises a dualtwo gigahertz G5 PowerMac computer.
 7. The inspection system of claim 1wherein the high speed interface bus protocol is PCI-X.
 8. Theinspection system of claim 1 wherein the second high speed network is agigabit Ethernet network.
 9. The inspection system of claim 1 whereineach interface card further comprises a field programmable gate arrayadapted to format the image data for transfer according to the highspeed interface bus protocol.
 10. The inspection system of claim 1wherein each interface card further comprises a memory adapted toreceive and buffer the image data between the interface card and thecomputer.
 11. The inspection system of claim 1 wherein each interfacecard further comprises four fiber inputs adapted to receive the imagedata from the first high speed network.
 12. The inspection system ofclaim 1 wherein: the sensor array provides the image data in foursections, the first high speed network comprises four independent lines,each of the four independent lines coupled to a corresponding one of thefour sections of the sensor array, and the array of process nodescomprises four columns of process nodes, and each of the four columns ofprocess nodes is coupled to a corresponding one of the four independentlines.
 13. An inspection system for detecting anomalies on a substrate,the inspection system comprising: a sensor array adapted to generateimage data and provide the image data in four sections, a first highspeed network having four independent lines, each of the fourindependent lines coupled to a corresponding one of the four sections ofthe sensor array, and adapted to receive and communicate the image data,wherein the first high speed network is a fiber optic network thatimplements a serial, full duplex data transfer architecture, the firsthigh speed network, an array of process nodes coupled to the first highspeed network and adapted to receive and process the image data toproduce anomaly reports, the array of process nodes having four columnsof process nodes, where each of the four columns of process nodes iscoupled to a corresponding one of the four independent lines, eachprocess node having, an interface card coupled to the first high speednetwork and adapted to receive the image data from the first high speednetwork and format the image data according to a high speed interfacebus protocol, wherein the high speed interface bus protocol is PCI-X,each interface card having, a field programmable gate array adapted toformat the image data for transfer according to the high speed interfacebus protocol, a memory adapted to receive and buffer the image databetween the interface card and the computer, four fiber inputs adaptedto receive the image data from the first high speed network, a highspeed interface bus coupled to the interface card and adapted to receivethe image data from the interface card, and a computer coupled to thehigh speed interface bus and adapted to receive the image data from thehigh speed interface bus and process the image data according to analgorithm to produce the anomaly report, wherein each of the processnodes has an amount of memory that is sufficient to receive image datarepresenting a plurality of dice on an integrated circuit wafer, andeach of the process nodes performs analysis on the plurality of dice, asecond high speed network coupled to the process nodes and adapted toreceive the anomaly reports from the process nodes, wherein the secondhigh speed network is a gigabit Ethernet network, and a job managercoupled to the second high speed network and adapted to receive theanomaly reports from the process nodes and send information to theprocess nodes to coordinate the processing of the image data in thearray of process nodes.
 14. The inspection system of claim 13 whereinthe sensor array includes a time delay arid integration sensor.
 15. Theinspection system of claim 13 wherein each process node comprises acommercially available computer.
 16. The inspection system of claim 13wherein each process node comprises a dual two gigahertz G5 PowerMaccomputer.